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TS991SNL500T3 Picture

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TS991SNL500T3

  • Chip Quik Inc.
  • New
  • SOLDER PASTE THERMALLY STABLE NC
  • Datasheet download
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In Stock:1,002(Ref. price)
Qty.Unit PriceExt. Price
1
$100.81400
$100.81400
Documents
Specifications
DescriptionDetails
Series
CHIPQUIK®
Package
Bulk
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423°F (217°C)
Flux Type
No-Clean
Wire Gauge
-
Process
Leaded
Form
Jar, 17.64 oz (500g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-
Other
Price advantage, TS991SNL500T3 is available in stock and can be delivered on the same day
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