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TS391SNL250 Picture

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TS391SNL250

  • Chip Quik Inc.
  • New
  • THERMALLY STABLE SOLDER PASTE NO
  • Datasheet download
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In Stock:17,774(Ref. price)
Qty.Unit PriceExt. Price
1
$67.85150
$67.85150
Documents
Specifications
DescriptionDetails
Series
-
Package
Bulk
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean
Wire Gauge
-
Process
Lead Free
Form
Jar, 8.8 oz (250g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
68°F ~ 77°F (20°C ~ 25°C)
Other
Price advantage, TS391SNL250 is available in stock and can be delivered on the same day
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