UPD70F3829GB(R)-GAH-AX Renesas Electronics America Inc

Microcontrollers

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Specifications

Description	Details
Series	V850ES/Jx3-E
Package	Tray
Core Processor	V850ES
Core Size	32-Bit
Speed	50MHz
Connectivity	CANbus, CSI, Ethernet, I²C, UART/USART, USB
Peripherals	DMA, LVD, PWM, WDT
Number of I/O	26
Program Memory Size	256KB (256K x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	64K x 8
Voltage - Supply (Vcc/Vdd)	2.85V ~ 3.6V
Data Converters	A/D 10x10b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	64-LQFP
Supplier Device Package	-

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Price advantage, UPD70F3829GB(R)-GAH-AX is available in stock and can be delivered on the same day

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