MK30DX64VMB7 NXP USA Inc. | XinMi Marketplace

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Specifications

Description	Details
Series	Kinetis K30
Package	Tray
Core Processor	ARM® Cortex®-M4
Core Size	32-Bit
Speed	72MHz
Connectivity	CANbus, I²C, IrDA, SD, SPI, UART/USART
Peripherals	DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O	56
Program Memory Size	64KB (64K x 8)
Program Memory Type	FLASH
EEPROM Size	2K x 8
RAM Size	16K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V
Data Converters	A/D 31x16b; D/A 1x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 105°C (TA)
Mounting Type	Surface Mount
Package / Case	81-LBGA
Supplier Device Package	81-MAPBGA (10x10)

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Price advantage, MK30DX64VMB7 is available in stock and can be delivered on the same day

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