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HF115AC-0.0055-AC-105 Picture

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HF115AC-0.0055-AC-105

  • Bergquist
  • New
  • THERM PAD 36.83MMX21.29MM W/ADH
  • Datasheet download
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In Stock:20,046(Ref. price)
Qty.Unit PriceExt. Price
1
$0.05197
$0.05197
Documents
Specifications
DescriptionDetails
Series
Hi-Flow® 115-AC
Package
Bulk
Usage
SIP
Type
Pad, Sheet
Shape
Rectangular
Outline
36.83mm x 21.29mm
Thickness
0.0055" (0.140mm)
Material
Phase Change Compound
Adhesive
Adhesive - One Side
Backing, Carrier
Fiberglass
Color
Gray
Thermal Resistivity
0.35°C/W
Thermal Conductivity
0.8W/m-K
Other
Price advantage, HF115AC-0.0055-AC-105 is available in stock and can be delivered on the same day
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