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Thermal - Heat Sinks
APF19-19-13CB Picture

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APF19-19-13CB

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In Stock:18,270(Ref. price)
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Documents
Specifications
DescriptionDetails
Series
APF
Package
Box
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Shape
Square, Fins
Length
0.748" (19.00mm)
Width
0.748" (19.00mm)
Diameter
-
Fin Height
0.500" (12.70mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
4.00°C/W @ 200 LFM
Thermal Resistance @ Natural
-
Material
Aluminum
Material Finish
Black Anodized
Other
Price advantage, APF19-19-13CB is available in stock and can be delivered on the same day
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