APA-316-G-K Samtec Inc. | XinMi Marketplace

Sockets for ICs Transistors

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Specifications

Description	Details
Series	APA
Package	Bulk
Type	-
Number of Positions or Pins (Grid)	16 (2 x 8)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Contact Material - Mating	Phosphor Bronze
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	20.0µin (0.51µm)
Contact Material - Post	Phosphor Bronze
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-

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Price advantage, APA-316-G-K is available in stock and can be delivered on the same day

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