24-3554-16 Aries Electronics | XinMi Marketplace

Sockets for ICs Transistors

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In Stock：20,762(Ref. price)

Qty.	Unit Price	Ext. Price
1	$35.99740	$35.99740

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Specifications

Description	Details
Series	55
Package	Bulk
Type	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	24 (2 x 12)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Nickel Boron
Contact Finish Thickness - Mating	50.0µin (1.27µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Nickel Boron
Contact Finish Thickness - Post	50.0µin (1.27µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature	-

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Price advantage, 24-3554-16 is available in stock and can be delivered on the same day

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