VSMC’s first Singapore 300mm fab has entered risk production, with volume manufacturing scheduled for 2027.
VisionPower Semiconductor Manufacturing Co. Pte. Ltd. (VSMC), a joint venture between Vanguard International Semiconductor Corp. (VIS) and NXP Semiconductors, has completed construction of its first 12-inch (300mm) semiconductor fab in Tampines, Singapore.
The facility has entered the risk production stage, with volume production scheduled to begin in the first quarter of 2027. VSMC held the fab’s groundbreaking ceremony in December 2024 and completed construction in 22 months.
The fab has processed its first sample lot with yields above 99%, according to the company. It will manufacture devices using process technologies ranging from 130nm to 40nm, covering mixed-signal, power management, analog and interposer applications for high-performance computing, mobile, automotive, industrial and consumer markets.
At full capacity, planned for 2029, the facility is expected to produce about 44,000 300mm wafers per month and employ approximately 1,600 people.
Leuh Fang, VSMC and VIS chairman, said the facility will expand VIS’ manufacturing presence in Singapore and support specialty IC demand.
“Today’s opening ceremony marks a significant milestone for VSMC and reflects VIS’ long-term commitment to deepening its presence in Singapore while expanding its global footprint. Since establishing the joint venture in 2024, we have worked closely with NXP Semiconductors and our partners to complete construction of our first 12-inch fab. With the fab now officially operational, we will be better positioned to meet our customers’ growing demand for specialty IC manufacturing, further strengthen the resilience of the global semiconductor supply chain, and contribute to the continued growth of Singapore’s high-tech industry and semiconductor ecosystem.”
Rafael Sotomayor, president and CEO of NXP Semiconductors, said the joint venture expands NXP’s manufacturing base and geographic supply resilience.
“The VSMC joint venture fab marks an important milestone in further strengthening NXP’s manufacturing base and assurance to support long-term customer demand. Building on decades of operations and investment in Singapore, VSMC enhances our geographic resilience, supply control, and cost competitiveness, while advancing our differentiated hybrid manufacturing strategy. Our planned manufacturing capacity at VSMC remains unchanged, helping us drive sustainable growth and deliver the innovative technologies that are enabling the next generation of intelligent edge and Physical AI systems.”
The facility is designed for automated manufacturing and incorporates AI and digital management technologies. VSMC also said the fab was designed and constructed to meet LEED and Singapore Green Mark standards, with renewable energy, energy-efficiency and water-recycling measures.
Cindy Koh, executive vice president at the Singapore Economic Development Board, highlighted the facility’s contribution to Singapore’s semiconductor manufacturing capacity and workforce development.
“VSMC’s fab reflects the strong confidence that global companies continue to place in Singapore as a global node for advanced manufacturing and semiconductor value chain. Beyond adding new capabilities and capacity to Singapore’s semiconductor ecosystem, VSMC’s collaborations with our institutes of higher learning will equip our local workforce to contribute to technologies that shape industries and trends. VSMC’s efforts across carbon abatement, energy efficiency and water recycling reflects its ongoing commitment to more sustainable manufacturing practices in Singapore.”
VSMC has also signed MOUs with Singapore universities and established internship and professional training programs as part of its semiconductor workforce development efforts.