NDS Taiwan will feature its integrated warpage control solution at the upcoming SEMICON Southeast Asia 2026 in Malaysia.
As semiconductor packaging shifts from wafer-level to panel-level formats, warpage has emerged as a critical challenge impacting process stability and yield. From bonding and thinning to RDL formation and debonding, stress accumulated across each stage can lead to deformation, misalignment, and yield loss.
To address these challenges, NDS Taiwan presents an integrated warpage control solution built on coordinated process and material strategies. Rather than treating each step independently, this approach focuses on managing stress evolution across the entire panel manufacturing flow to ensure greater process stability.
At the front end, Balance Film acts as a stress compensation layer, helping to mitigate deformation caused by thermal and mechanical effects while stabilizing panel geometry. This is complemented by temporary bonding with a glass carrier, which provides mechanical support during thinning and subsequent processing.
In the material removal stage, high-precision grinding enables accurate thickness control while minimizing TTV and subsurface damage, establishing a reliable foundation for downstream processes. As the process advances into planarization, polishing equipment, pads, and slurry additives are integrated to enhance surface flatness and reduce defectivity, ensuring a stable base for fine-pitch RDL formation.
Finally, clean debonding ensures safe carrier removal with minimal residue, preserving surface integrity and supporting consistent downstream performance. Through this integrated approach, warpage is no longer treated as an isolated issue, but as a controllable parameter throughout the PLP workflow.
Warpage control is the foundation of stable PLP manufacturing. By combining materials, equipment, and process expertise, NDS Taiwan enables a scalable, high-yield solution for next-generation panel-level packaging.
NDS Taiwan will feature its integrated warpage control solution at the upcoming SEMICON Southeast Asia 2026 event, to be held May 5–7, 2026, at MITEC in Kuala Lumpur, Malaysia. NDS Taiwan will be at Booth 1640.